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    Jiangsu Mhchxm has launched the TO-263M ultra-thin package with a thickness of 1.7mm, which is more than 60% thinner than the traditional TO-263 package, achieving product miniaturization and more space saving.
        
      
    
        New Product Announcement
        Return List
      
    
    
    

    



    
    
    
    
    
        
    
            Product Introduction
            By adopting a thinner packaging structure, the product can be made lighter and thinner, with a thickness reduction of more than 60% compared to the conventional TO-263 packaging. It is suitable for customers to design smaller products and can effectively save space. It can support packaging products such as Schottky diodes, fast recovery diodes, rectifiers, silicon carbide diodes, MOS, etc. It uses environmentally friendly materials and complies with RoHS standards; 					
        
    
        
    
            Product Features
            1. Low height (typical value of 1.7mm)
    
2. Reduce power loss
    
3. High efficiency and reliability
    
4. Can be pin compatible with TO-263-2L package
    
5. Compared with TO-277 and DFN packaging, it can maximize the rated power, achieve miniaturization and space saving design.
    
6. Meet the MSL1 humidity sensitivity level standard    
        
    
    
    

    




 




 

 

 
 



    

    Product selection recommendation
    




    
    
    Schottky diode
    
     
    

    



    
    
    低正向壓降肖特基二極管
    
     
    

    




    
    
    Ultrafast recovery diode
    
     
    

    



    
    
    Fast recovery diode
    
     
    

    




    
    
    Low voltage drop fast recovery diode
    
     
    

    




    
    
    Rectifier diode
    
     
    

    




    
    
    Silicon carbide diode
    
     
    

    







    
    
    MOS
    
     
    

    





    



 




    














 





      

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